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Epoxy Bond vs. Solder Bond Applications
Bond assembly can be done via 1) mechanical attachment, 2) adhesive bonding of which epoxy bonding is one form of adhesive, 3) soldering bonding using lower melting filler metals (< 450˚C), 4)...
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S-Bond® Active Soldering of High Purity Fused Silica for Optical Devices
S-Bond® Ultrasonic Active Soldering of Silica Ronald Smith S-Bond Technologies Inc., Hatfield, PA, Lawrence W. Shacklette, Michael R. Lange, James C. Beachboard, Harris Corp., Melbourne, FL and...
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